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PRODUCTS

Micro-Grain Phosphorus Copper

The Products will go through the Microcrystalline process. The structure will be microctystal state

* Smooth surface with good plumpness
* Be able to form a firm and strong anode film
* Enlarge the cycle period of cleaning plated cylinders
* Increasing the utilization of the Copper, It can sace 3% in total.

Technical Parameters

Copper(%) Phosphor(%)
Cu P
≥99.90% 0.025%≤P≤  0.050%
Impurity(%)
Ag Fe Pb Ni Zn
≤0.003% ≤0.003% ≤0.003% ≤0.003% ≤0.003%

Main model

Size (inches) Size (mm) Model
φ4/5 φ20 CP111M
φ1 φ25 CP112M
φ11/10 φ28 CP113M
φ3/2 φ38 CP116M
φ9/5 φ45 CP118M
φ2 φ51 CP119M
φ11/5 φ55 CP1191M